Temperature Rise in Al 7075 Cold Wire Drawing Using Finite Element Method

Abstract

In this work the temperature rise in AL7075 wire drawing is predicted numerically using
a 3D finite element model. The commercial code Deform-3D was used to construct the model
and simulate the wire drawing process. Aluminum wire of 46.38mm was drawn at room
temperature through a conical die with semi-die angle ?=5
°
and percentage reduction in area
equal to 10%. This case was run for different values of friction coefficient (?=0.05, 0.075,
0.1, 0.125, 0.15, 0.175, 0.2). The result shows that as the coefficient of friction increases, the
temperature rises in linear form. The behavior of temperature rise distribution is studied in
details for ?=0.1, for this case the temperature rise in wire during the drawing process is
(22.3C
o
) less than in die (28.7C
o
), also the location of maximum temperature in the die occurs
at the contact area before wire exit from the die