البنية المجهرية والية الربط لملحومات القوس الكهربائي غير المتماثلة فولاذ الى النحاس

  • عبد الله عذيب مشاري قسم الميكانيك / المعهد التقني - السماوة
Keywords: Bonding mechanism, microstructure, epitaxial growth, onepitaxial growth

Abstract

The aim of this work is to study thebonding mechanism and the microstructure of
copper to steel welded by shielded metal arc welding (SMAW). The electrodes that used are
ECuSi and ECuSn8thenthe examination of microstructure by optical microscopic, it is clearly
observed that the copper side are completely interfering with epitaxial growth when using
ECuSn8 but the side of steel reveal interaction waves at the interface with nonepitaxial
growth. Some of fine cracks observed at the interface with ECuSi. The use of ECuSn8 explain
interfering fine blockes from the steel inside the fusion zone

Published
2019-04-30
Section
Articles