البنية المجهرية وآلية الربط للاحومات القوس الكهربائي غير المتماثلة فولاذ الى نحاس
DOI:
https://doi.org/10.31663/Keywords:
Bonding mechanism, microstructure, epitaxial growth, onepitaxial growthAbstract
The aim of this work is to study thebonding mechanism and the microstructure of
copper to steel welded by shielded metal arc welding (SMAW). The electrodes that used are
ECuSi and ECuSn8thenthe examination of microstructure by optical microscopic, it is clearly
observed that the copper side are completely interfering with epitaxial growth when using
ECuSn8 but the side of steel reveal interaction waves at the interface with nonepitaxial
growth. Some of fine cracks observed at the interface with ECuSi. The use of ECuSn8 explain
interfering fine blockes from the steel inside the fusion zone
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Copyright (c) 2011 The Author(s), under exclusive license to the University of Thi-Qar
This work is licensed under a Creative Commons Attribution 4.0 International License.