Temperature Rise in Al 7075 Cold Wire Drawing Using Finite Element Method

Abstract

In this work the temperature rise in AL7075 wire drawing is predicted numerically using a 3D finite element model. The commercial code Deform-3D was used to construct the model and simulate the wire drawing process. Aluminum wire of 46.38mm was drawn at room temperature through a conical die with semi-die angle α=5°and percentage reduction in area equal to 10%. This case was run for different values of friction coefficient (μ=0.05, 0.075, 0.1, 0.125, 0.15, 0.175, 0.2). The result shows that as the coefficient of friction increases, the temperature rises in linear form. The behavior of temperature rise distribution is studied in details for μ=0.1, for this case the temperature rise in wire during the drawing process is (22.3Co) less than in die (28.7Co), also the location of maximum temperature in the die occurs at the contact area before wire exit from the die.